Daily Papers

In this paper, we prove representation bottlenecks of a cascaded convolutional decoder network, considering the capacity of representing different frequency components of an input sample. We conduct the discrete Fourier transform on each channel of the feature map in an intermediate layer of the decoder network. Then, we introduce the rule of the forward propagation of such intermediate-layer spectrum maps, which is equivalent to the forward propagation of feature maps through a convolutional layer. Based on this, we find that each frequency component in the spectrum map is forward propagated independently with other frequency components. Furthermore, we prove two bottlenecks in representing feature spectrums. First, we prove that the convolution operation, the zero-padding operation, and a set of other settings all make a convolutional decoder network more likely to weaken high-frequency components. Second, we prove that the upsampling operation generates a feature spectrum, in which strong signals repetitively appears at certain frequencies.

Automated detection of defects in Printed Circuit Board (PCB) manufacturing using Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) machines can help improve operational efficiency and significantly reduce the need for manual intervention. In this paper, using SPI-extracted features of 6 million pins, we demonstrate a data-centric approach to train Machine Learning (ML) models to detect PCB defects at three stages of PCB manufacturing. The 6 million PCB pins correspond to 2 million components that belong to 15,387 PCBs. Using a base extreme gradient boosting (XGBoost) ML model, we iterate on the data pre-processing step to improve detection performance. Combining pin-level SPI features using component and PCB IDs, we developed training instances also at the component and PCB level. This allows the ML model to capture any inter-pin, inter-component, or spatial effects that may not be apparent at the pin level. Models are trained at the pin, component, and PCB levels, and the detection results from the different models are combined to identify defective components.

AI agents are systems capable of perceiving their environment, autonomously planning and executing tasks. Recent advancements in LLM have introduced a transformative paradigm for AI agents, enabling them to interact with external resources and tools through prompts. In such agents, the workflow integrates developer-written code, which manages framework construction and logic control, with LLM-generated natural language that enhances dynamic decision-making and interaction. However, discrepancies between developer-implemented logic and the dynamically generated content of LLMs in terms of behavior and expected outcomes can lead to defects, such as tool invocation failures and task execution errors. These issues introduce specific risks, leading to various defects in LLM-based AI Agents, such as service interruptions. Despite the importance of these issues, there is a lack of systematic work that focuses on analyzing LLM-based AI Agents to uncover defects in their code. In this paper, we present the first study focused on identifying and detecting defects in LLM Agents. We collected and analyzed 6,854 relevant posts from StackOverflow to define 8 types of agent defects. For each type, we provided detailed descriptions with an example. Then, we designed a static analysis tool, named Agentable, to detect the defects. Agentable leverages Code Property Graphs and LLMs to analyze Agent workflows by efficiently identifying specific code patterns and analyzing natural language descriptions. To evaluate Agentable, we constructed two datasets: AgentSet, consists of 84 real-world Agents, and AgentTest, which contains 78 Agents specifically designed to include various types of defects. Our results show that Agentable achieved an overall accuracy of 88.79% and a recall rate of 91.03%. Furthermore, our analysis reveals the 889 defects of the AgentSet, highlighting the prevalence of these defects.

Vision Transformer models trained on large-scale datasets, although effective, often exhibit artifacts in the patch token they extract. While such defects can be alleviated by re-training the entire model with additional classification tokens, the underlying reasons for the presence of these tokens remain unclear. In this paper, we conduct a thorough investigation of this phenomenon, combining theoretical analysis with empirical observations. Our findings reveal that these artifacts originate from the pre-trained network itself, specifically stemming from the leading left singular vector of the network's weights. Furthermore, to mitigate these defects, we propose a novel fine-tuning smooth regularization that rectifies structural deficiencies using only a small dataset, thereby avoiding the need for complete re-training. We validate our method on various downstream tasks, including unsupervised segmentation, classification, supervised segmentation, and depth estimation, demonstrating its effectiveness in improving model performance. Codes and checkpoints are available at https://github.com/haoqiwang/sinder.

Retrieval-augmented generation (RAG) enhances large language models (LLMs) by integrating external knowledge retrieved from a knowledge base. However, its effectiveness is fundamentally constrained by the reliability of both the retriever and the knowledge base. In real-world scenarios, imperfections in these components often lead to the retrieval of noisy, irrelevant, or misleading counterfactual information, ultimately undermining the trustworthiness of RAG systems. To address this challenge, we propose Robust Fine-Tuning (RbFT), a method designed to enhance the resilience of LLMs against retrieval defects through two targeted fine-tuning tasks. Experimental results demonstrate that RbFT significantly improves the robustness of RAG systems across diverse retrieval conditions, surpassing existing methods while maintaining high inference efficiency and compatibility with other robustness techniques.

Manufacturing wafers is an intricate task involving thousands of steps. Defect Pattern Recognition (DPR) of wafer maps is crucial to find the root cause of the issue and further improving the yield in the wafer foundry. Mixed-type DPR is much more complicated compared to single-type DPR due to varied spatial features, the uncertainty of defects, and the number of defects present. To accurately predict the number of defects as well as the types of defects, we propose a novel compact deformable convolutional transformer (DC Transformer). Specifically, DC Transformer focuses on the global features present in the wafer map by virtue of learnable deformable kernels and multi-head attention to the global features. The proposed method succinctly models the internal relationship between the wafer maps and the defects. DC Transformer is evaluated on a real dataset containing 38 defect patterns. Experimental results show that DC Transformer performs exceptionally well in recognizing both single and mixed-type defects. The proposed method outperforms the current state of the models by a considerable margin

Defect inspection is paramount within the closed-loop manufacturing system. However, existing datasets for defect inspection often lack precision and semantic granularity required for practical applications. In this paper, we introduce the Defect Spectrum, a comprehensive benchmark that offers precise, semantic-abundant, and large-scale annotations for a wide range of industrial defects. Building on four key industrial benchmarks, our dataset refines existing annotations and introduces rich semantic details, distinguishing multiple defect types within a single image. Furthermore, we introduce Defect-Gen, a two-stage diffusion-based generator designed to create high-quality and diverse defective images, even when working with limited datasets. The synthetic images generated by Defect-Gen significantly enhance the efficacy of defect inspection models. Overall, The Defect Spectrum dataset demonstrates its potential in defect inspection research, offering a solid platform for testing and refining advanced models.

Identifying defect patterns in a wafer map during manufacturing is crucial to find the root cause of the underlying issue and provides valuable insights on improving yield in the foundry. Currently used methods use deep neural networks to identify the defects. These methods are generally very huge and have significant inference time. They also require GPU support to efficiently operate. All these issues make these models not fit for on-line prediction in the manufacturing foundry. In this paper, we propose an extremely simple yet effective technique to extract features from wafer images. The proposed method is extremely fast, intuitive, and non-parametric while being explainable. The experiment results show that the proposed pipeline outperforms conventional deep learning models. Our feature extraction requires no training or fine-tuning while preserving the relative shape and location of data points as revealed by our interpretability analysis.

As the globalization of semiconductor design and manufacturing processes continues, the demand for defect detection during integrated circuit fabrication stages is becoming increasingly critical, playing a significant role in enhancing the yield of semiconductor products. Traditional wafer map defect pattern detection methods involve manual inspection using electron microscopes to collect sample images, which are then assessed by experts for defects. This approach is labor-intensive and inefficient. Consequently, there is a pressing need to develop a model capable of automatically detecting defects as an alternative to manual operations. In this paper, we propose a method that initially employs a pre-trained VAE model to obtain the fault distribution information of the wafer map. This information serves as guidance, combined with the original image set for semi-supervised model training. During the semi-supervised training, we utilize a teacher-student network for iterative learning. The model presented in this paper is validated on the benchmark dataset WM-811K wafer dataset. The experimental results demonstrate superior classification accuracy and detection performance compared to state-of-the-art models, fulfilling the requirements for industrial applications. Compared to the original architecture, we have achieved significant performance improvement.

The usage of electronic devices increases, and becomes predominant in most aspects of life. Surface Mount Technology (SMT) is the most common industrial method for manufacturing electric devices in which electrical components are mounted directly onto the surface of a Printed Circuit Board (PCB). Although the expansion of electronic devices affects our lives in a productive way, failures or defects in the manufacturing procedure of those devices might also be counterproductive and even harmful in some cases. It is therefore desired and sometimes crucial to ensure zero-defect quality in electronic devices and their production. While traditional Image Processing (IP) techniques are not sufficient to produce a complete solution, other promising methods like Deep Learning (DL) might also be challenging for PCB inspection, mainly because such methods require big adequate datasets which are missing, not available or not updated in the rapidly growing field of PCBs. Thus, PCB inspection is conventionally performed manually by human experts. Unsupervised Learning (UL) methods may potentially be suitable for PCB inspection, having learning capabilities on the one hand, while not relying on large datasets on the other. In this paper, we introduce ChangeChip, an automated and integrated change detection system for defect detection in PCBs, from soldering defects to missing or misaligned electronic elements, based on Computer Vision (CV) and UL. We achieve good quality defect detection by applying an unsupervised change detection between images of a golden PCB (reference) and the inspected PCB under various setting. In this work, we also present CD-PCB, a synthesized labeled dataset of 20 pairs of PCB images for evaluation of defect detection algorithms.

Quality control is of vital importance during electronics production. As the methods of producing electronic circuits improve, there is an increasing chance of solder defects during assembling the printed circuit board (PCB). Many technologies have been incorporated for inspecting failed soldering, such as X-ray imaging, optical imaging, and thermal imaging. With some advanced algorithms, the new technologies are expected to control the production quality based on the digital images. However, current algorithms sometimes are not accurate enough to meet the quality control. Specialists are needed to do a follow-up checking. For automated X-ray inspection, joint of interest on the X-ray image is located by region of interest (ROI) and inspected by some algorithms. Some incorrect ROIs deteriorate the inspection algorithm. The high dimension of X-ray images and the varying sizes of image dimensions also challenge the inspection algorithms. On the other hand, recent advances on deep learning shed light on image-based tasks and are competitive to human levels. In this paper, deep learning is incorporated in X-ray imaging based quality control during PCB quality inspection. Two artificial intelligence (AI) based models are proposed and compared for joint defect detection. The noised ROI problem and the varying sizes of imaging dimension problem are addressed. The efficacy of the proposed methods are verified through experimenting on a real-world 3D X-ray dataset. By incorporating the proposed methods, specialist inspection workload is largely saved.

In this work we explore the application of AI to robotic welding. Robotic welding is a widely used technology in many industries, but robots currently do not have the capability to detect welding defects which get introduced due to various reasons in the welding process. We describe how deep-learning methods can be applied to detect weld defects in real-time by recording the welding process with microphones and a camera. Our findings are based on a large database with more than 4000 welding samples we collected which covers different weld types, materials and various defect categories. All deep learning models are trained in an unsupervised fashion because the space of possible defects is large and the defects in our data may contain biases. We demonstrate that a reliable real-time detection of most categories of weld defects is feasible both from audio and video, with improvements achieved by combining both modalities. Specifically, the multi-modal approach achieves an average Area-under-ROC-Curve (AUC) of 0.92 over all eleven defect types in our data. We conclude the paper with an analysis of the results by defect type and a discussion of future work.

Shrinking pattern dimensions leads to an increased variety of defect types in semiconductor devices. This has spurred innovation in patterning approaches such as Directed self-assembly (DSA) for which no traditional, automatic defect inspection software exists. Machine Learning-based SEM image analysis has become an increasingly popular research topic for defect inspection with supervised ML models often showing the best performance. However, little research has been done on obtaining a dataset with high-quality labels for these supervised models. In this work, we propose a method for obtaining coherent and complete labels for a dataset of hexagonal contact hole DSA patterns while requiring minimal quality control effort from a DSA expert. We show that YOLOv8, a state-of-the-art neural network, achieves defect detection precisions of more than 0.9 mAP on our final dataset which best reflects DSA expert defect labeling expectations. We discuss the strengths and limitations of our proposed labeling approach and suggest directions for future work in data-centric ML-based defect inspection.

We study the conformal bootstrap of 1D CFTs on the straight Maldacena-Wilson line in 4D {cal N}=4 super-Yang-Mills theory. We introduce an improved truncation scheme with an 'OPE tail' approximation and use it to reproduce the 'bootstrability' results of Cavagli\`a et al. for the OPE-coefficients squared of the first three unprotected operators. For example, for the first OPE-coefficient squared at 't Hooft coupling (4pi)^2, linear-functional methods with two sum rules from integrated correlators give the rigorous result 0.294014873 pm 4.88 cdot 10^{-8}, whereas our methods give with machine-precision computations 0.294014228 pm 6.77 cdot 10^{-7}. For our numerical searches, we benchmark the Reinforcement Learning Soft Actor-Critic algorithm against an Interior Point Method algorithm (IPOPT) and comment on the merits of each algorithm.

In this study, we applied the PointRend (Point-based Rendering) method to semiconductor defect segmentation. PointRend is an iterative segmentation algorithm inspired by image rendering in computer graphics, a new image segmentation method that can generate high-resolution segmentation masks. It can also be flexibly integrated into common instance segmentation meta-architecture such as Mask-RCNN and semantic meta-architecture such as FCN. We implemented a model, termed as SEMI-PointRend, to generate precise segmentation masks by applying the PointRend neural network module. In this paper, we focus on comparing the defect segmentation predictions of SEMI-PointRend and Mask-RCNN for various defect types (line-collapse, single bridge, thin bridge, multi bridge non-horizontal). We show that SEMI-PointRend can outperforms Mask R-CNN by up to 18.8% in terms of segmentation mean average precision.

In recent years, the deterioration of artificial materials used in structures has become a serious social issue, increasing the importance of inspections. Non-destructive testing is gaining increased demand due to its capability to inspect for defects and deterioration in structures while preserving their functionality. Among these, Laser Ultrasonic Visualization Testing (LUVT) stands out because it allows the visualization of ultrasonic propagation. This makes it visually straightforward to detect defects, thereby enhancing inspection efficiency. With the increasing number of the deterioration structures, challenges such as a shortage of inspectors and increased workload in non-destructive testing have become more apparent. Efforts to address these challenges include exploring automated inspection using machine learning. However, the lack of anomalous data with defects poses a barrier to improving the accuracy of automated inspection through machine learning. Therefore, in this study, we propose a method for automated LUVT inspection using an anomaly detection approach with a diffusion model that can be trained solely on negative examples (defect-free data). We experimentally confirmed that our proposed method improves defect detection and localization compared to general object detection algorithms used previously.

Genuine leather, such as the hides of cows, crocodiles, lizards and goats usually contain natural and artificial defects, like holes, fly bites, tick marks, veining, cuts, wrinkles and others. A traditional solution to identify the defects is by manual defect inspection, which involves skilled experts. It is time consuming and may incur a high error rate and results in low productivity. This paper presents a series of automatic image processing processes to perform the classification of leather defects by adopting deep learning approaches. Particularly, the leather images are first partitioned into small patches,then it undergoes a pre-processing technique, namely the Canny edge detection to enhance defect visualization. Next, artificial neural network (ANN) and convolutional neural network (CNN) are employed to extract the rich image features. The best classification result achieved is 80.3 %, evaluated on a data set that consists of 2000 samples. In addition, the performance metrics such as confusion matrix and Receiver Operating Characteristic (ROC) are reported to demonstrate the efficiency of the method proposed.

In recent years, Printed Circuit Boards (PCB) have become the backbone of a large number of consumer electronic devices leading to a surge in their production. This has made it imperative to employ automatic inspection systems to identify manufacturing defects in PCB before they are installed in the respective systems. An important task in this regard is the classification of defects as either true or pseudo defects, which decides if the PCB is to be re-manufactured or not. This work proposes a novel approach to detect most common defects in the PCBs. The problem has been approached by employing highly discriminative features based on multi-scale wavelet transform, which are further boosted by using a kernalized version of the support vector machines (SVM). A real world printed circuit board dataset has been used for quantitative analysis. Experimental results demonstrated the efficacy of the proposed method.

This survey paper offers a comprehensive review of methodologies utilizing machine learning (ML) classification techniques for identifying wafer defects in semiconductor manufacturing. Despite the growing body of research demonstrating the effectiveness of ML in wafer defect identification, there is a noticeable absence of comprehensive reviews on this subject. This survey attempts to fill this void by amalgamating available literature and providing an in-depth analysis of the advantages, limitations, and potential applications of various ML classification algorithms in the realm of wafer defect detection. An innovative taxonomy of methodologies that we present provides a detailed classification of algorithms into more refined categories and techniques. This taxonomy follows a three-tier structure, starting from broad methodology categories and ending with specific techniques. It aids researchers in comprehending the complex relationships between different algorithms and their techniques. We employ a rigorous empirical and experimental evaluation to rank these varying techniques. For the empirical evaluation, we assess techniques based on a set of five criteria. The experimental evaluation ranks the algorithms employing the same techniques, sub-categories, and categories. Also the paper illuminates the future prospects of ML classification techniques for wafer defect identification, underscoring potential advancements and opportunities for further research in this field

Reproducing buggy code is the first and crucially important step in issue resolving, as it aids in identifying the underlying problems and validating that generated patches resolve the problem. While numerous approaches have been proposed for this task, they primarily address common, widespread errors and struggle to adapt to unique, evolving errors specific to individual code repositories. To fill this gap, we propose EvoCoder, a multi-agent continuous learning framework for issue code reproduction. EvoCoder adopts a reflection mechanism that allows the LLM to continuously learn from previously resolved problems and dynamically refine its strategies to new emerging challenges. To prevent experience bloating, EvoCoder introduces a novel hierarchical experience pool that enables the model to adaptively update common and repo-specific experiences. Our experimental results show a 20\% improvement in issue reproduction rates over existing SOTA methods. Furthermore, integrating our reproduction mechanism significantly boosts the overall accuracy of the existing issue-resolving pipeline.

Is there a statistical difference between Naive Bayes and Random Forest in terms of recall, f-measure, and precision for predicting software defects? By utilizing systematic literature review and meta-analysis, we are answering this question. We conducted a systematic literature review by establishing criteria to search and choose papers, resulting in five studies. After that, using the meta-data and forest-plots of five chosen papers, we conducted a meta-analysis to compare the two models. The results have shown that there is no significant statistical evidence that Naive Bayes perform differently from Random Forest in terms of recall, f-measure, and precision.